Session by Dr. Charan Gurumurthy, Director Systems & Components Engineering on topic Glimpses of Semiconductor Fabrication was conducted on 13.02.2019 at CET EC Dept. He manages a worldwide engineering team responsible for end to end integration of components and systems across all Business Units of Intel. He joined Intel in 2002 and has made pioneering contributions to High Density Interconnect (HDI) Substrates and “Real Sense” Imaging that has positioned Intel’s Technology at a competitive advantage in the industry. Prior to Intel he worked at IBM’s Microelectronics Division & IBM T.J. Watson Research Center. Charan has a Ph.D. in Materials Science and Engineering from Cornell University and a B.Tech degree in Mechanical Engineering from the Indian Institute of Technology (IIT). He has authored 55+ patents and 15+ journal publications. He currently serves as Associate Editor for IEEE Transactions on Advanced Packaging. He has won numerous Intel and external awards for his contributions including “IEEE Engineer of the Year” award in 2015.
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